GS600SWA wafer-level dispensing machine x 2
GS600SWB wafer-level dispensing machine x 2
PC100 wafer loading & unloading machine x 1
WxDxH : 3200x 4000x 2200mm
Supporting 12-inch wafer dispensing.
Dustproof level 10, meeting the environmental requirements of wafer level packaging.
High ESD standard, above IEC and ANSI standards.
In the whole process of wafer turnover and operation, the temperature is finely controlled and automatically corrected to meet the CUF process needs while ensuring the product safety.
The whole-process video monitoring facilitates product turnover, operation process observation, and problem tracing and analysis.
CUF Special Piezoelectric Jetting System
Adhesive insulation + piezoelectric ceramic temperature closed-loop control to avoid system instability caused by temperature influence
Triple Low-Level Alarm
Capacitive detection + magnetic detection + system weighing to avoid poor operation caused by lack of glue
Vacuum Adsorption Heating Fixture
The temperature difference of the whole surface of the fixture is ≤ ±1.5°C, and the temperature is monitored and compensated in real time to avoid poor operation caused by product temperature variation during operation
The vacuum suction fixture always keeps still, and the track moves up and down to avoid poor operation caused by loss of flatness during reciprocating movement of the vacuum adsorption fixture
Platform-Type Loading & Unloading System
The feeding sequence is automatically sorted, and the operation is completed within the Plasma time limit
Friendly human-machine interface design
Positioning and detection functions
Inspection before operation to avoid defective incoming materials
Inspection after operation to prevent batch defects
Work positions are inspected before and after operation, and the final station is professionally inspected to achieve multiple fool proof.
The on-line mode is used to minimize manual intervention.
Prevention of Whole Line Downtime
Operation/conveyor tracks are separated,so that shutdown of a single machine does not affect the operation of the whole line.
Meeting Information Management Requirements
Real-time MES system docking, upload of production status information, and system abnormal status alarm.Supporting SECS/GEM semiconductor communication protocol.
Meeting Stringent Engineering Requirements
Class-100 dustproof design (modeling and simulation, dust-proof components and cables, and gas filtration, etc.). ESD prevention design (in accordance with IEC61340 and ANSI/ESDS20.20 standards).Anti-vibration (mineral frame and good shock absorption to effectively reduce the impact caused by high-speed movement).
With the parallel method, UPH is increased by over 10% compared with the traditional online dispensing platform, and the downtime of a single station does not affect the whole line production.
The online AOI method is used to prevent batch defects.
Inclined Rotation Module
Suitable for side dispensing process
360° Rotation Module
Suitable for mushroom head dispensing process
Prevention of Whole Line Downtime
Operation/conveyor track separation
Shutdown of a single machine not affecting the operation of the whole line
Gold wire protection glue
Chip protection glue
Flip Chip underfill
Dust catching glue
FPC reinforcement glue
Conductive silver paste
PIN sealing glue
Professional glue effect testing to improve the reliability of the mounting process.
Dispensing + mounting and mounting + dispensing processes can be considered at the same time, achieving stronger applicability.
The dispensing station is compatible with piezoelectric jetting valves and inclined rotation shafts, meeting the requirements of multi-side dispensing process and high-precision dispensing.
The bond head has the pressure calibration function to facilitate the quantitative management of production.
The mounting system has the one-key calibration function to save the changeover time.
With the parallel method, the downtime of a single station does not affect the whole line production.
Suitable for appearance inspection of various kinds of glue.
To inspect glue overflow, glue breakage, leakage points, scattered points, bubbles and insufficient glue area.
According to the type of Tray, Mark, Mapping and Sorting can be selected to handle NG products.
The stand-alone or on-line mode can be selected according to the application.
Product status inspection before operation
Glue status inspection after operation
Real-Time MES Docking
Upload of production status information in real time
System abnormal status alarm
Reduction of Particle Contamination
Class-100 dustproof design
Rich Configuration Options
Weighing and other configuration options
High Speed and High Precision
Linear motor driving, grating ruler positioning, and mineral casting platform
After precise visual recognition, the single machine completes the flux injection and soldering, effectively improving the welding yield.
Precise control to improve the consistency of solder joint appearance quality.
Helping the semiconductor and precision electronic component manufacturing equipment to realize time precision and productivity jump,
realize real-time feedback and compensation of pressure changes, realize fast-paced, highly-stable and ultra-fine dispensing;
simple operation and easy maintenance, and rich supporting components and process solutions
For such process applications as semiconductor chip packaging and MEMS in which solder paste/silver paste is used to achieve conductive connection, common valves have problems such as low efficiency or high maintenance costs for consumables. Especially, mainstream 5# and 6# solder pastes are spotted, and the solder balls are easily broken by shock and thus block the nozzle.
When a conventional pneumatic dispensing controller is used in the above process applications, its slow output pressure response and low pressure stability, etc. lead to relatively poor dispensing consistency.
The KDC series controller with high-precision needles can perfectly solve the above problems.
Automatic Level Compensation
The deviation of glue amount caused by the level difference is eliminated, realizing stable dispensing and reducing poor production process.
Automatic Negative Pressure Compensation
The automatic suction pressure control can effectively prevent glue dripping and help eliminate bubbles to ensure stable dispensing.
Automatic Remaining Amount Warning
By accurately detecting the remaining glue amount in the bucket and comparing it with the set threshold, you are reminded to replace the glue bucket in time to prevent glue shortage.
The servo motor and the grinding screw module are used to ensure high precision, high speed, high efficiency and high consistency of the system during operation.
The repetitive positioning accuracy of the platform can be up to 0.01mm; and in combination with independent core pneumatic controller or jetting valve, high-precision and stable discharge and precise trajectory control of the fluid can be achieved.
The stable glue line width or glue dot diameter of 0.2mm can be achieved by the non-contact method.
Intelligent modules such as intelligent visual recognition, laser height measurement, automatic needle correction, online UV exposure and liquid level detection are available for selection.
The unique dispensing process module is compatible with blowing and suction method for automatic valve cleaning, effectively preventing glue hanging.